The world of condensed-matter and materials physics is entering a new era. Experimental condensed matter physics and materials physics gains a fundamental understanding of the properties of materials at the atomic scale has been a major goal driving basic research in condensed matter and materials physics Beyond the intellectual pursuit, many of the recent major technological advances in consumer electronics are a direct result of fundamental condensed matter and materials physics research. Condensed Matter and materials physics experimental research labs are working on the materials, technologies, and devices that we will be able to use in the future to make our lives easier, healthier - and more sustainable. The focus of condensed matter and materials physics (CMMP) is understanding how underlying laws unfold in the physical world around us. This materials physics conference brings Extraordinary research advances in instrumentation are providing access to the world of atoms and molecules on an unprecedented scale.
Related: | Materials Physics Conference | Materials Science Conference | Materials Physics Congress | Materials Science Congress | Materials Physics Meetings | Materials Science Meetings | Physics Conference | Physics Conferences |
Related Conferences:
International Conference on Quantum Physics, September 20-22, 2018, Frankfurt, Germany; International Conference on Medical Physics September 6-8, 2018, Edinburgh, Scotland; 3rd International Conference on Applied Physics, August 23-25, London, UK; 3rd International Conference on Plasma Physics , June 7-8, 2018, London; Condensed and Materials Physics Conference, August 16-17, 2018, London, UK.
Related Societies and Associations:
| French Society of Physics | Institute of Physics | American Institute of Physics | Ontario Association of Physics teachers | American Association of Physics Teachers | Australian Institute of Physics | Philippine Physics Society |
All accepted abstracts will be published in respective Allied Academies Journals.
Abstracts will be provided with Digital Object Identifier by
